A늌W

2013 Seminar

20130713 (Stanford, CA)

e-beam inspection C principles and applications in wafer fabrication

Abstract:

e-beam inspection (EBI) tool is a special designed scanning electron microscope (SEM) for use with semiconductor industry. It has the capabilities to automatically image, detect, classify and even review the yield-limiting defects at different stages of wafer processing. The detectable defects include (1) physical defects on surface or residue inside shallow trench, (2) under-etch or over-etch of via or contact holes, (3) buried electrical defects leading to open or short circuits, (4) material missing or poor-forming associated with Epitaxial growth.This seminar covers the basic principles of SEM, fundamentals of electron optics, principles of EBI; defect behavior and voltage contrast; real case discussions.

Bio: Yan Zhao is the Director of World Wide Technical Support of Hermes-MicrovisionInc (HMI). He has more than 20 years experience in the SEM and 13 years experience EBI application. He receivedMSc in Electron Physics at Xian JiaotongUniversity and Ph.D. in EE at the National University of Singapore. He authored/coauthored more than 15 journal and conference papers, and received 7 patents.